Printed circuit boards are mainly used in products of information technology, communications, automobiles, semiconductors, consumer electronics, etc. Not only do permanent materials such as substrates, interlayer, outermost solder protection and soldered connection materials differ based on the requirements of different products, but the requirements of indirect materials used in the manufacturing process will also be different.
Based on the materials used, process technology and product applications, printed circuit boards can be mainly divided into different products such as Rigid PCB, Flexible PCB, Rigid-Flexible Composite PCB and IC boards. In recent years, because of the rapid development of intelligent products, the trend of various PCB products has accelerated toward compact sizes and high-density circuit layouts. The technical requirements for additional layers of fine lines, pore size and high alignment accuracy are also rising.
Composite Epoxy Copper Clad Laminate (CEM-1)
The Composite Epoxy Copper Clad Laminate (CEM-1) is composed of two substrates, whose fabric uses fiberglass cloth and core material uses bleached kraft paper. The Single-sided Copper Clad Laminate is the main product.
The mechanical properties and manufacturing costs of Composite Epoxy Copper Clad Laminate (CEM-1) are between those of Epoxy Fiberglass Fabric Copper Clad Laminate (FR-4) and Paper Phenolic Copper Clad Laminate (XPC/FR-1), and it is suitable for punching and drilling. With the improvement of CEM-1 products in properties such as Comparative Tracking Index (CTI), dimensional precision and dimensional stability, there are already products using CEM-1 as a replacement for CEM-3 and FR-4 laminates to reduce costs.